| 【英語タイトル】Semiconductor Metrology and Inspection Equipment Market Forecasts to 2032 – Global Analysis By Equipment Type (Lithography Metrology, Wafer Inspection, Thin Film Metrology, and Other Equipment Types), Technology, Application, End User and By Geography
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 | ・商品コード：SMRC31761
・発行会社（調査会社）：Stratistics MRC
・発行日：2025年10月
・ページ数：150
・レポート言語：英語
・レポート形式：PDF
・納品方法：Eメール（受注後2-3営業日）
・調査対象地域：グローバル
・産業分野：半導体
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❖ レポートの概要 ❖
Stratistics MRCによると、世界の半導体計測・検査装置市場は2025年に97.7億米ドル、2032年に177.6億米ドルへ拡大し、予測期間中の年平均成長率は8.9%と見込まれています。半導体計測・検査装置は、製造工程におけるウエハーやデバイスの特性を微細スケールで測定・解析し、欠陥、寸法ばらつき、不整合を検出するための高度な機器で、工程管理の高度化、歩留まり最大化、厳格な業界規格への適合を支え、高性能で信頼性の高い半導体の実現に不可欠な基盤技術です。背景として、AI・5G・自動運転などの高度用途拡大により「高品質・低欠陥」への要求が急速に高まっており、微細化が進むほど許容誤差が縮小するため、高解像度の計測・検査投資が加速しています。光学検査や電子ビーム（e-beam）技術の進化により、欠陥のリアルタイム検出や工程最適化が進む点も成長を後押しします。一方で、5nm未満の先端ノードでは3D構造や多層パッケージの解析が必要となり、生成データが膨大化することで解析基盤（高度解析やHPC）への負荷が増大し、検査速度が生産スピードに追いつきにくいスループットのボトルネックや、既存ファブへの統合難度・設備投資負担が普及の制約として挙げられます。機会領域としては、チップレット、2.5D/3D IC、ファンアウトWLPなど先端パッケージの拡大により、配線接続部、バンプ高さ、TSVなどの高精度計測ニーズが増大し、光学・X線・ハイブリッド計測の融合が進むことで、専門装置ベンダーに成長機会が生まれるとされています。脅威は技術陳腐化の速さで、微細化とアーキテクチャ高度化により装置の更新・置換が頻繁化し、メーカー側のR&D・設備コスト増につながる点が課題です。COVID-19では供給網混乱による納入遅延があった一方、復旧局面で自動化・遠隔監視の重要性が再認識され、AI対応・クラウド連携の検査装置や非接触・予知保全ソリューション開発が加速し、地域分散やサプライチェーン強靭化の動きも促しました。
セグメントでは、先端ノードでのパターン忠実度と重ね合わせ精度の確保が重要になるため、リソグラフィ計測が最大市場になる見通しです。EUVの普及に伴い、CD（臨界寸法）やLER（ラインエッジラフネス）などの精密測定需要が増し、AI/機械学習による欠陥分類と工程制御の高度化が採用を後押しします。エンドユーザーでは、先端パッケージの複雑化を受けてOSATが最も高い成長率が予測され、X線、音響、ハイブリッド計測などの導入が進むとされます。地域別では、中国・台湾・韓国・日本など製造集積と投資が厚いアジア太平洋が最大シェア、北米はR&D投資とファブ新設、米国CHIPS法等の資金支援を背景に最も高いCAGRが見込まれます。主要企業としてKLA、アプライドマテリアルズ、ASML、東京エレクトロン、日立ハイテク、レーザーテック、SCREEN、ニコン、アドバンテスト、ZEISS、Onto Innovation、Nova、Camtek、JEOL、東レエンジニアリングなどが挙げられ、装置タイプ（リソ計測、ウエハ検査、薄膜計測等）、技術（光学、赤外/熱、電子ビーム、X線、走査プローブ）、用途（前工程、後工程パッケージ、R&D、品質保証等）で市場が整理されています。なお、参考情報として、2025年3月時点の公表情報では、最先端のスーパーコンピュータが約20万個のAIチップを搭載し、ハードウェア費用が約70億米ドル、消費電力が約300MW規模に達する例が示されており、先端半導体需要の強さが計測・検査装置の重要性を一段と高める文脈として触れられています。 |
According to Stratistics MRC, the Global Semiconductor Metrology and Inspection Equipment Market is accounted for $9.77 billion in 2025 and is expected to reach $17.76 billion by 2032 growing at a CAGR of 8.9% during the forecast period. Semiconductor Metrology and Inspection Equipment comprises advanced instruments designed to assess and monitor the characteristics of semiconductor wafers and devices during manufacturing. These tools help identify defects, dimensional variations, and irregularities, ensuring accuracy, quality, and consistency. By enabling precise measurement and analysis at extremely small scales, they play a vital role in process control, maximizing production yield, and adhering to rigorous industry standards, thereby facilitating the creation of reliable and high-performance semiconductor components for electronic applications.
According to arXiv in March 2025, the leading supercomputer used approximately 200,000 AI chips cost USD 7 billion in hardware, and draw 300 MW of power.
Market Dynamics:
Driver:
Rising demand for higher chip quality and yield
The semiconductor industry is witnessing a surge in demand for chips with superior performance and minimal defects. This trend is driven by the proliferation of advanced applications such as AI, 5G, and autonomous systems, which require extremely precise fabrication. As device geometries shrink, the margin for error narrows, making high-resolution metrology and inspection tools indispensable. Manufacturers are increasingly investing in next-generation equipment to ensure tighter process control and higher production yields. Innovations in optical and e-beam inspection technologies are enabling real-time defect detection and process optimization. This heightened focus on quality assurance is expected to significantly propel market growth across the value chain.
Restraint:
Increasing system complexity and throughput bottlenecks
As semiconductor nodes advance below 5nm, the complexity of inspection and metrology systems has grown exponentially. These tools must now analyze intricate 3D structures and multilayered packaging with extreme precision. However, the volume of data generated during inspection is massive, requiring sophisticated analytics and high-performance computing infrastructure. This creates throughput challenges, as inspection speed often lags behind production rates. Additionally, integrating these systems into existing fab workflows demands specialized expertise and significant capital investment. These operational and technical hurdles are slowing down widespread adoption, acting as a brake on market acceleration.
Opportunity:
Growing need for advanced packaging metrology
As chiplets, 2.5D/3D ICs, and fan-out wafer-level packaging gain traction, precise measurement of interconnects, bump heights, and TSVs becomes critical. Emerging metrology solutions are being designed to handle these complex architectures with nanometer-level accuracy. Equipment vendors are collaborating with OSATs and IDMs to develop tools tailored for advanced packaging lines. The convergence of optical, X-ray, and hybrid metrology techniques is enabling comprehensive inspection across layers. This evolving landscape presents a significant growth opportunity for specialized metrology providers.
Threat:
Rapid technological obsolescence
The semiconductor industry evolves swiftly, driven by continuous innovations in chip design, miniaturization, and manufacturing processes. As nodes shrink and device architectures become more complex, existing metrology and inspection tools can quickly become outdated, requiring frequent upgrades or complete replacements. This shortens product life cycles and increases R&D and capital costs for manufacturers. Companies that fail to keep pace with emerging technologies risk losing competitiveness, as customers demand advanced solutions for precision and accuracy. Consequently, the pace of innovation poses a persistent challenge to maintaining technological relevance and profitability.
Covid-19 Impact:
The COVID-19 pandemic initially disrupted global supply chains, delaying the delivery and installation of metrology and inspection equipment. However, it also underscored the importance of automation and remote monitoring in semiconductor fabs. As a result, demand for AI-enabled, cloud-connected inspection tools surged during the recovery phase. Vendors accelerated the development of contactless and predictive maintenance solutions to reduce human intervention. The crisis also prompted strategic shifts toward regional manufacturing and supply chain resilience.
The lithography metrology segment is expected to be the largest during the forecast period
The lithography metrology segment is expected to account for the largest market share during the forecast period, due to its critical role in ensuring pattern fidelity and overlay accuracy at advanced nodes. As EUV lithography becomes mainstream, the need for precise measurement of critical dimensions and line-edge roughness intensifies. These tools are essential for detecting patterning defects that could compromise device performance. Continuous improvements in resolution, sensitivity, and throughput are driving adoption across leading-edge fabs. Equipment providers are also integrating AI and machine learning to enhance defect classification and process control.
The OSAT providers segment is expected to have the highest CAGR during the forecast period
Over the forecast period, the OSAT providers segment is predicted to witness the highest growth rate, driven by the rising complexity of advanced packaging. As chipmakers increasingly rely on OSATs for 2.5D/3D integration and heterogeneous assembly, demand for specialized metrology tools is surging. These providers are investing in high-precision inspection systems to ensure interconnect reliability and package integrity. Innovations in X-ray, acoustic, and hybrid metrology are being rapidly adopted to meet stringent quality standards. The growing trend of fab-lite models and design outsourcing further amplifies OSATs’ strategic importance. This shift positions them as key growth drivers in the evolving semiconductor landscape.
Region with largest share:
During the forecast period, the Asia Pacific region is expected to hold the largest market share, fueled by robust semiconductor manufacturing ecosystems in countries like China, Taiwan, South Korea, and Japan. These nations are home to major foundries and IDMs that are aggressively investing in advanced metrology infrastructure. Government initiatives supporting domestic chip production and R&D are further accelerating regional growth. The presence of leading equipment vendors and a strong OSAT base enhances the demand for inspection tools. Additionally, the region’s focus on AI, 5G, and automotive electronics is driving the need for higher chip quality.
Region with highest CAGR:
Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, driven by strong investments in semiconductor R&D and fab expansion. The U.S. CHIPS Act and related funding initiatives are catalyzing domestic manufacturing and equipment innovation. Leading players are developing next-gen metrology tools to support sub-5nm and 3D packaging technologies. The region’s emphasis on AI-driven analytics, cybersecurity, and automation is enhancing inspection capabilities. Collaborations between academia, national labs, and industry are fostering a vibrant innovation ecosystem.
Key players in the market
Some of the key players in Semiconductor Metrology and Inspection Equipment Market include KLA Corporation, Toray Engineering Co., Ltd., Hitachi High-Tech Corporation, JEOL Ltd., Applied Materials Inc., Lasertec Corporation, Onto Innovation Inc., SCREEN Holdings Co., Ltd., ASML Holding N.V., Advantest Corporation, Tokyo Electron Limited, Nikon Corporation, Nova Ltd., Carl Zeiss SMT GmbH, and Camtek Ltd.
Key Developments:
In August 2025, Hitachi Energy has completed the acquisition of the remaining stake in eks Energy, a technology and market leader in power electronics and control solutions to deliver a scalable, flexible, and complete approach for energy storage customers. Hitachi Energy acquired a majority stake in eks Energy.
In April 2025, Major League Pickleball (MLP) and Japanese materials manufacturer Toray Industries, Inc. announced an agreement naming Toray a platinum partner with Kitchen branding at the professional, coed, team pickleball league’s events. This partnership makes Toray the first-ever Asia-based partner of MLP, expanding the league’s brand reach internationally as pickleball continues its unmatched domestic growth.
Equipment Types Covered:
• Lithography Metrology
• Wafer Inspection
• Thin Film Metrology
• Other Equipment Types
Technologies Covered:
• Optical Metrology
• Infrared and Thermal Imaging
• Electron Beam Metrology
• X-ray Metrology
• Scanning Probe Metrology
Applications Covered:
• Front-End Semiconductor Manufacturing
• Back-End Semiconductor Packaging
• R&D and Process Development
• Quality Assurance and Reliability Testing
• Other Applications
End Users Covered:
• Integrated Device Manufacturers (IDMs)
• Foundries
• Outsourced Semiconductor Assembly and Test (OSAT) Providers
• Research Institutions
• Other End Users
Regions Covered:
• North America
US
Canada
Mexico
• Europe
Germany
UK
Italy
France
Spain
Rest of Europe
• Asia Pacific
Japan
China
India
Australia
New Zealand
South Korea
Rest of Asia Pacific
• South America
Argentina
Brazil
Chile
Rest of South America
• Middle East & Africa
Saudi Arabia
UAE
Qatar
South Africa
Rest of Middle East & Africa
1 Executive Summary
2 Preface
2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
2.4.1 Data Mining
2.4.2 Data Analysis
2.4.3 Data Validation
2.4.4 Research Approach
2.5 Research Sources
2.5.1 Primary Research Sources
2.5.2 Secondary Research Sources
2.5.3 Assumptions
3 Market Trend Analysis
3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Technology Analysis
3.7 Application Analysis
3.8 End User Analysis
3.9 Emerging Markets
3.10 Impact of Covid-19
4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry
5 Global Semiconductor Metrology and Inspection Equipment Market, By Equipment Type
5.1 Introduction
5.2 Lithography Metrology
5.2.1 Overlay Metrology
5.2.2 Critical Dimension (CD) Metrology
5.2.3 Mask Inspection/Metrology
5.3 Wafer Inspection
5.3.1 Defect Inspection
5.3.2 Unpatterned Wafer Inspection
5.3.3 Patterned Inspection
5.4 Thin Film Metrology
5.4.1 Film Thickness Measurement
5.4.2 Refractive Index Profiling
5.5 Other Equipment Types
6 Global Semiconductor Metrology and Inspection Equipment Market, By Technology
6.1 Introduction
6.2 Optical Metrology
6.3 Infrared and Thermal Imaging
6.4 Electron Beam Metrology
6.5 X-ray Metrology
6.6 Scanning Probe Metrology
7 Global Semiconductor Metrology and Inspection Equipment Market, By Application
7.1 Introduction
7.2 Front-End Semiconductor Manufacturing
7.3 Back-End Semiconductor Packaging
7.4 R&D and Process Development
7.5 Quality Assurance and Reliability Testing
7.6 Other Applications
8 Global Semiconductor Metrology and Inspection Equipment Market, By End User
8.1 Introduction
8.2 Integrated Device Manufacturers (IDMs)
8.3 Foundries
8.4 Outsourced Semiconductor Assembly and Test (OSAT) Providers
8.5 Research Institutions
8.6 Other End Users
9 Global Semiconductor Metrology and Inspection Equipment Market, By Geography
9.1 Introduction
9.2 North America
9.2.1 US
9.2.2 Canada
9.2.3 Mexico
9.3 Europe
9.3.1 Germany
9.3.2 UK
9.3.3 Italy
9.3.4 France
9.3.5 Spain
9.3.6 Rest of Europe
9.4 Asia Pacific
9.4.1 Japan
9.4.2 China
9.4.3 India
9.4.4 Australia
9.4.5 New Zealand
9.4.6 South Korea
9.4.7 Rest of Asia Pacific
9.5 South America
9.5.1 Argentina
9.5.2 Brazil
9.5.3 Chile
9.5.4 Rest of South America
9.6 Middle East & Africa
9.6.1 Saudi Arabia
9.6.2 UAE
9.6.3 Qatar
9.6.4 South Africa
9.6.5 Rest of Middle East & Africa
10 Key Developments
10.1 Agreements, Partnerships, Collaborations and Joint Ventures
10.2 Acquisitions & Mergers
10.3 New Product Launch
10.4 Expansions
10.5 Other Key Strategies
11 Company Profiling
11.1 KLA Corporation
11.2 Toray Engineering Co., Ltd.
11.3 Hitachi High-Tech Corporation
11.4 JEOL Ltd.
11.5 Applied Materials Inc.
11.6 Lasertec Corporation
11.7 Onto Innovation Inc.
11.8 SCREEN Holdings Co., Ltd.
11.9 ASML Holding N.V.
11.10 Advantest Corporation
11.11 Tokyo Electron Limited
11.12 Nikon Corporation
11.13 Nova Ltd.
11.14 Carl Zeiss SMT GmbH
11.15 Camtek Ltd.
List of Tables
1 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Region (2024-2032) ($MN)
2 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Equipment Type (2024-2032) ($MN)
3 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Lithography Metrology (2024-2032) ($MN)
4 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Overlay Metrology (2024-2032) ($MN)
5 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Critical Dimension (CD) Metrology (2024-2032) ($MN)
6 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Mask Inspection/Metrology (2024-2032) ($MN)
7 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Wafer Inspection (2024-2032) ($MN)
8 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Defect Inspection (2024-2032) ($MN)
9 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Unpatterned Wafer Inspection (2024-2032) ($MN)
10 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Patterned Inspection (2024-2032) ($MN)
11 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Thin Film Metrology (2024-2032) ($MN)
12 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Film Thickness Measurement (2024-2032) ($MN)
13 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Refractive Index Profiling (2024-2032) ($MN)
14 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Other Equipment Types (2024-2032) ($MN)
15 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Technology (2024-2032) ($MN)
16 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Optical Metrology (2024-2032) ($MN)
17 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Infrared and Thermal Imaging (2024-2032) ($MN)
18 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Electron Beam Metrology (2024-2032) ($MN)
19 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By X-ray Metrology (2024-2032) ($MN)
20 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Scanning Probe Metrology (2024-2032) ($MN)
21 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Application (2024-2032) ($MN)
22 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Front-End Semiconductor Manufacturing (2024-2032) ($MN)
23 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Back-End Semiconductor Packaging (2024-2032) ($MN)
24 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By R&D and Process Development (2024-2032) ($MN)
25 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Quality Assurance and Reliability Testing (2024-2032) ($MN)
26 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Other Applications (2024-2032) ($MN)
27 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By End User (2024-2032) ($MN)
28 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Integrated Device Manufacturers (IDMs) (2024-2032) ($MN)
29 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Foundries (2024-2032) ($MN)
30 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Outsourced Semiconductor Assembly and Test (OSAT) Providers (2024-2032) ($MN)
31 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Research Institutions (2024-2032) ($MN)
32 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Other End Users (2024-2032) ($MN)
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.
